High density hybrid integrated circuit

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Cited By (4)

    Publication numberPublication dateAssigneeTitle
    JP-H01321695-ADecember 27, 1989Mitsubishi Mining & Cement Co LtdCeramic composite circuit substrate
    JP-H04225594-AAugust 14, 1992Internatl Business Mach Corp Multi-layer circuit package and its manufacturing method
    JP-H0541579-AFebruary 19, 1993Nikko Co, ニツコー株式会社低温焼結多層基板
    JP-S6489393-AApril 03, 1989Kyocera CorpMultilayer interconnection board